Laser machining facility

The NdYAG laser system with integrated computer controlled coordinate table is used to manufacture fine-scale mechanical and electro-optical components. The capability of this equipment allows us to manufacture parts which would not be possible by conventional machining methods, but without the constraints of lithographic technology. This includes readout anodes (e.g. Wedge & Strip and Vernier) for use in Microchannel plate detectors.

Substrate positioned on x-y tables

Specification:

• Nd-YAG - CW 15W, Q-switched peak power 30 kW
• Focussed Beam Diameter - 10 to 100 microns (therefore we can create a slot approx 10 µm wide or greater)
• Computer controlled co-ordinate table 1 µm accuracy and 150 mm travel

Applications

• Precision machining of designs (etched lines) in thin films on insulating substrates (Glass, Ceramics, etc.)
• Machining of sheet metal (e.g. Phosphor Bronze, Stainless Steel) up to a maximum thickness of 0.5 mm

Contact: Louisa Bradley ljb@mssl.ucl.ac.uk

Sputter Coating Facility

Sputtering provides a means of depositing thin film coatings onto substrates. Our sputtering facility, an Edwards ESM100, can operate in DC and RF modes; DC is used for conductors and RF for insulators (RF can also be used for conductors). Before applying a thin film the ESM100 can be used to sputter clean (back sputter) a substrate which removes surface contamination within a few minutes.

Typical applications include the manufacture of anodes for use in Microchannel plate detectors) by coating quartz substrates with chrome/gold/copper and coating a 300mm quartz disc with gold for use in our electron gun assembly.

Edwards ESM100 sputter facility

Choice of film material:

• Aluminium
• Copper
• Gold
• Chrome
• Insulators e.g. SiO₂
• others can be installed
• all targets are 100 mm diameter

Substrate dimensions:

• Thickness up to 30 mm
• For optimum coating uniformity substrates of up to 60 mm diameter may be accomodated.
• It is possible to coat larger parts, up to 300 mm diameter.

Contact: Louisa Bradley ljb@mssl.ucl.ac.uk

Westbond wirebonder

• This tool allows small scale interconnects to be placed between metal pads.
• Ultrasonically bonds the connecting wires to the pads.
• Wire may be gold or aluminium, diameter range 18-100 µm.
• Used in the manufacture of readout anodes (for Microchannel plate detectors) to bridge insulating gaps.

Contact: Louisa Bradley ljb@mssl.ucl.ac.uk

©MSSL Created by Alex Rousseau last modified: February 2, 2004 12:04